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Diamond film properties, applications and research status

at. 2ndIntCon {o 【theApp 【ofDiamondFitmendRelat-edMaterials, Japan: 1993.3618MichaelSea1.1stlntCont \U. S. A: 1991,39 Kold】 P. WitdC,】 IocherR, eta】. 2ridInterCooiltheApp [ofDiamondFilmsandRelatedMaterla] stJapan {1993,8710 GrebnerJE, JinS,mbt casual shoes, KammtnttGW, etalNaturt, 2361992,359:40111 MatsumotoS. SatoY, KamoM, eta1. JMaterSci, 1982,2:18312 NishibayashiY. Shiom [H, Fujimor [N. 1tInterCon [Qu theApp [ofDiamondFilmsaadRelatedMateriaLs. U. SA: 1991.29513MaedaH, DieM, OhtsuboK, eta__3rdlntConfontheApplofDiamoadFilmsandReLatedMateriats. U. SA: 1995, P. 8914Michaelsea13rdIntConf0ntheApp [ofDiamondFilmsandReLatedMaterials. US. A, 1995,315 SuzudiK, SawabeA, YasudaH, etalApp [PhysLett. 1987.50 = 72816OhtakeN, lkegamiMtYoshlkawaM. DiamondFiLmsandTechnology, 1992,2:117 GivargizovEI, Aksenova 【, l_. eal3rdlntConfontheApp [ofDiamondFilmsandReLatedMaterials, US. A: 1995.4518ShinichiOiika, SatoshiYvmashita,MBT Fora Shoes, ... __JpnJApp [Phys, 1992.32:20019 M ~ ranakaY, YamashitaH, SatoK, etatJApplPhys, 1990.67:624720 BachmannPK. LeersandD. 1. ydtinH. DiamondandRelatedMateriaLa, 1991.1:121 JiangX, KlagesCP, ZachalR, a1. App [PhysLett. 19g3, 62:343822 MaedaH, lrieM, HinoT, etaIJMaterRes. 1 cicada 5.1O: 1582almerWD, MancusiJE, Bal 【CA, etalIEEETran ~ conELactronDevice,MAC 120 color eyeshadow, 1994,41:186624 KaniaDR, UP. LaadenON, etalJApplPhysLett, 1990,68:91325 LandstrassMI, FteetwoodDMApp [PhysLett,MBT shoes sale, 1990.56:2316 Gu Zhi Shenyang City, Liaoning Province who, in June 1964 students. He graduated from Jilin University in 1991, received a Master of Science Electrical Engineering t Superhard Materials, Jilin University is now the State Key Laboratory, Associate Professor since 1994. Field of research involving thin films of,MAC Cosmetics Cheap, properties and application. Focus on the diamond films and the thermal, electrical and other properties than the system gives the thermal conductivity of diamond film major factor f in the diamond film radiation materials and circuit aspects of the groundbreaking research. More than 5O papers have been published patent applications by t 3. \
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