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ZM21 magnesium alloy extrusion process on the microstructure and properties of

【M】 basis and its application. Beijing: Mechanical Industry Press, 2002. 【4] PavelLukOc, DietmarLetzig, KarlUlrichKainer. Theel'-fectofgrainsizeonthedeformationbehaviourofmagne-siumalloysInvestigatedbytheacousticemissiontechniquefJ]. AdvancedEngineeringMaterials, 2006, (10) :2-4. 【5] BohlenJan, LetzigDietmar, KainerKarlUlrich. InfluenceofprocessparametersonthemechanicalpropertiesofrolledmagnesiumZM21-sheets [J]. MetalsandMaterialsSociety, 2007, (5) :95-100. [6】 BalloniL, SpigarelliS, EvangelistaE,[link widoczny dla zalogowanych], eta1. HotworkabilityandconstitutiveequationsofZM21magnesiumalloy 【J]. KeyEngineeringMaterials ,2008,367:79-86. [7] Li Shubo, Zou Zhiwen, Wu Kun, et al. AZ91D magnesium alloy during hot compression of microstructure evolution [J]. Chinese Journal of Nonferrous Metals, 2007,17 (7): 1O41.1047. [8] Liu, namely, Haitao, Sheng Xiao Fang, et al. Toughening mechanism of magnesium alloys and methods to explore complex [J]. Shenyang University of Technology, 2006,28 (5) :482-485. [9] Ming-Bo Yang,[link widoczny dla zalogowanych], Pan Fu-sheng, Li Zhongsheng, et al. Grain refinement of cast magnesium alloy technology research progress [J]. Foundry, 2005,54 (4) :314-319. Field f on the next page 35) [3】 TsaoLC, ChangMJ, LinWH, eto1. Effectsofzincaddi-tionsonthemicrostructureandmeltingtemperaturesofAI-Si-Cufillermetals [Jj. MaterialsCharacterization, 2002,48 (4) :341-346. [4] SuzuliK, KagayamaM, TakeuchiY. Eutecticphaseequilib-riumofA1 a Si-Znsystemanditsapplicabilityforlowertem-peraturebrazing [J]. JpnInstLightMet, 1993,43 (1O) :533-538. 【5】 in the paper flowers, Zhu Ying, Kang Hui, et al. Alloying elements Cu, si, Ni-based solder on the A1 film nl ~ [J]. Welding Technology,[link widoczny dla zalogowanych], 2003,32 (2) :33-35. 【6] Yu feel strange. Rapid solidification Al-si based solder properties [J】. Metal Technology, 1994.15 (2): 67.73. Wei Yu Yuan, Xue-Ding Chen, Lu Wen Jiang. Rapidly solidified Al-Si-Cu based solder performance [J】. Welding Journal, 2004,25 (2) :69-72. LU Wen-Jiang, Liu and full, Wei Yu Yuan,[link widoczny dla zalogowanych], et al. A rapidly solidified A1 Cu-Si Brazing pot vacuum brazing alloy forging [J]. Gansu University of Technology, 2002, (3) :1-3. Chen Po, Lu Wen Jiang, Wei Yu Yuan, et al. LD2 vacuum brazing of aluminum alloy solder preparation and properties of [J]. Thermal processing technology, 2006. 35 (19) :48-5O. Zhao their chapter, Yu Jun, Zhao, et al. Al-Si. Cu-Zn solder Pina quench prepared and wettability 【J]. Jiangsu Science and Technology University,[link widoczny dla zalogowanych], 2007,21 (5) :31-35. CHE Xiao weeks. Brittleness of amorphous alloy quenched Research [J]. Luoyang Institute of Technology, 1992,4 (13) :66-68. Tin \
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