lompiacv
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 ed hardy clothing Three-dimensional movable metal |
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Three-dimensional movable metal substrate production of micro-institutions
lsflexibilityinaMEMSfabricationprocesslJJ. MicroelectromechSyst, 1999,8:161.13 JQuWN, WenzelC, JahnA, eta1. One-maskprocedureforthefabricationofmovablehigh - aspect-・ ratio3Dmi ・-crostructures 【JJ. MicromechMicroeng ,1998,8:279-283. [4] Wu Ying, Zhao-Ying Zhou, Jiang Yongqing,[link widoczny dla zalogowanych], et al. Three-dimensional microstructures of metal processing technology research [J]. Instrument Technique and Sensor, 2006 (1) :8-9,[link widoczny dla zalogowanych], 20. WuYing, ZhouZhaoying, JiangYongqing, eta1. MetalmicrostructurefabricationtechniquelJJ. InstrumentTechniqueandSensor, 2006 (1) :8-9, 20 (inChinese). [5] LehmannO, StukeM. Laser-drivenmovementofthree-dimensionalmicrostructuresgeneratedbylaserrapidpro-totypinglJJ. Science, 1995,270:1644.16 JGuckeiH. High-aspect-ratiomicromachiningviadeepX-raylithography [J]. ProceedingsoftheIEEE, 1998,86 ( : 1586.1593. [7] Xiao Day Song, Du Liqun, Liu Chong, et al. MEMS-Based Fabrication of micro mold [J]. High Technology Letters, 2006,16 (4): 368.371. XiaoRisong,[link widoczny dla zalogowanych], DuLiqun, LiuChong,[link widoczny dla zalogowanych], eta1. Researchonfabricationofmicro-moldbasedonMEMStechnology [J]. HighTechnologyLetter, 2006,16 (4): 368.371 (inChinese). [8] Zhu God vague, Du Liqun, Liu Chong, et al. A fuzzy neural network in SU 8 resist the application of stress research [J]. Nanotechnology and Precision Engineering, 2007. 5 (4) :323-326. ZhuShenmiao, DuLiqun, LiuChong, eta1. ApplicationoffuzzyneuralnetworkintheinternalstressofSU_8photoresist 【JJ. NanotechnologyandPrecisionEngi-neering, 2007,5 (4) :323-326 (inChinese). [9] Liu Jun Shan, Luo Yi, Du Yan, et al. Integrated copper electrode of poly methyl methacrylate electrophoresis chip production [J]. Analytical Chemistry, 2005,[link widoczny dla zalogowanych],33 (4): 584.587. LiuJunshan, LuoYi, DuYan, eta1. Fabricationofpoly-methylmethacrylateelectrophoresischipswithintegratedcopperelectrodes [J]. ChineseJournalofAnalyticalChemistry, 2005,33 (4): 584.587 (inChinese). [10] DentingerPM, CliffWM. GoodsSH. RemovalofSU a 8photoresistforthickfilmapplicationslJj. Microelec-tronicEngineering, 2002,61 / 62:993-1000.
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