lompiacv
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moncler günstig Wet etching surface blasting appl |
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,[link widoczny dla zalogowanych]
Wet etching surface blasting applications in progress
Sintering to study this SiC-si sintering of composite powders. To Sill and cH as reactive gases,[link widoczny dla zalogowanych], flow 0.050L/min (when the flow rate are 2O ℃ basis), the supply of nuclear particles of gas and heating gas to argon gas flow 5.0L/min, nuclear particles SiN The average size of 2Ixm, layer by vibrating feeder mobile feeding, feeding rate of 0.4g / h, and kept constant. Gas before and after reaction with a thermal conductivity detector - gas chromatography analysis, quantitative determination of the amount of SiH4 and CH, SiC ultrafine particles by XPS analysis, using si and c, the determination of the binding energy of the SiC. Transmission electron microscopy (JEOLJEM a 1000CX1I) observed on the nuclear particles Si3N ultrafine particles SiC. First test of the SiC ultrafine particles generated the most optimal conditions,[link widoczny dla zalogowanych], test to determine the optimal conditions for the supply of reactive gas C / Si flow ratio is 5, the reaction temperature is 1173K. Under these conditions, composite powders were prepared SiC/si3N. TEM observation showed that the nuclear particles si, N on the dispersion of particle size 2O ~ 6Onm of ultrafine particles. From SiC / Si ~ I 10mmx1mm composite powder pressed into the film, and then in nitrogen atmosphere, the temperature of 1173K, pressure 0.24MPa, to maintain the 3h, the simple sintering test. Commercial Si powders with the same test to compare their sintering. Easy Sintering tests showed that powder is not commercially available si3N sintering, and coated with SiC ultrafine particles to the sintering of composite powders. Composite powders by the XRD analysis results before and after sintering shows, SiC ratio of the peak before sintering in the sintering significantly increased, due to sintering to improve the crystallinity of ultrafine particles. As a small sample, the strength of sintered bodies have not been tested, but confirmed the obtained SiC / Si ~ easy to sintering of composite powders. Wu Quanxing Quoted \compressed air to slurry accelerated jet parts to be machined on the processing methods. The purpose of the different abrasives can choose according to the processing of ceramic, glass, resin. For example, to flash, surface roughening,[link widoczny dla zalogowanych], such as processing, high hardness of the polygon can be particles, such as the first alumina, silicon carbide; improve the metal surface hardness and mechanical strength of the surface hardening process that can be used spherical glass, ceramic particles, etc.; mild wash or do not want to damage the workpiece itself,[link widoczny dla zalogowanych], just remove the burr, etc., can be spherical or amorphous resin particles. Wet blasting can be used to etch the material surface, it does not use chemical etching of chemical reagents, thus avoiding the pollution of the environment, it can process more difficult chemical etching of organic materials, ceramic materials and materials from a variety of form of electronic circuit boards and so on. Wet sand blasting, the average processing of a particle particle diameter of about l/200 ~ 1 / 100, if the average particle diameter of 10I. Lm, then the impact of a processing capacity of 0.1 ~ 0.2I. Lm, this number can be handled, such as gun control etching speed, and control of surface roughness. With the high integration of electronic components, the use of rigid substrates are also substrates from the transition to flexible substrates. Polyimide represented by the polymer film with excellent resistance to buckling, heat resistance, but the bonding strength of copper foil is a serious problem, this is etched by wet blasting method, and achieved a very good results. 10m film about the surface of particles with wet sand blasting to remove surface contamination, deterioration layer, while surface roughness, the formation of tiny bump, play a role in anchoring effect. Tiny bump also improved moisten the film surface, improves the affinity of adhesive and diffusion. Using the new wide spray gun (muzzle length 30 ~ 600mm, width of 1 ~ 2.5mm) of thickness of tens of microns sandblasted films, film no damage, no wrinkles, can be very fine coarse surface. At present, Japan Macoho company has handled the substrate, the resin film, metal foil, thin pieces of sand, washed with water to dry automatic device commercialization, has made increasing performance. In the future, there are many issues blasting, such as the principle that can make use of nano-particles, which in the future may be in the field of nano-processing method. Wu Quanxing Quoted \
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